Simultaneous optimization of electroplating and CMP for copper processes

Solid State Technology

Volumn 44, Issue 11, 2001, Pages 83-84+86+88

  Banerjee, G ^a   So, J ^a   Mikkola, B ^a  

^a Rodel Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DEPOSITION; ELECTROPLATING; MORPHOLOGY; PROCESS ENGINEERING; SURFACE CHEMISTRY; THICKNESS CONTROL;

DISHING; PLANARIZATION PROCESSES; REMOVAL RATE; SURFACE DEFECTS; SURFACE FILM;

COPPER;

EID: 0035499142     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (2)

1. Implications of damascene topography for electroplated copper interconnects
2. Copper interconnects for high-volume manufacturing