Evaluating and treating CMP wastewater

Semiconductor International

Volumn 23, Issue 12, 2000, Pages

  Golden, Josh H ^a,d,e,f   Small, Robert ^b,c,g,h,i   Pagan, Louis ^b,j   Shang, Cass ^b,k,l,m   Ragavan, Srini ^c,n,o  

^a Microbar Inc   (United States)

^b EKC Technology Inc   (United States)

^c UNIVERSITY OF ARIZONA   (United States)

^d Department of Obstetrics Gynecology   (United States)

^e CYTEC INDUSTRIES INC   (United States)

^f Watkins Johnson ^*  (United States)

^g R and D Group at EKC Technology

^h NORWICH UNIVERSITY   (United States)

ⁱ TEXAS TECH UNIVERSITY   (United States)

^j R and D Area of EKC Technology

^k EKC Technology   (United States)

^l PEKING UNIVERSITY   (China)

^m UNIVERSITY OF COLORADO   (United States)

ⁿ NSF SRC Ctr Environmentally B

^o UNIVERSITY OF CALIFORNIA   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CUPRIC ION; HYDROXIDE; MASS BALANCE;

CHEMICALS REMOVAL (WATER TREATMENT); COAGULATION; COPPER OXIDES; EFFLUENTS; FLOCCULATION; HYDROGEN INORGANIC COMPOUNDS; MICROFILTRATION; PH EFFECTS; POSITIVE IONS; TOXICITY; WASTEWATER TREATMENT;

CHEMICAL POLISHING;

EID: 6744271951     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)

1. W C. O'Mara, "CMP Equipment and Materials Take Semiconductor Industry by Storm," Semiconductor Online, 10/12/99.
2. G.L. Corlett, "CMP Water Reduction and Waste Treatment Overview," Semiconductor Online, 3/17/99.
3. SIA, National Technology Roadmap for Semiconductors, 1997 Edition.
4. J. M. Steigerwald, S. P. Murarka, R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, Inc., N.Y., 1997.
5. G. Wu, L. Cook, "Mechanism of Copper Damascene CMP," Proc. 3rd Int'l CMP-MIC, Feb. 19-20 1998, p. 150.
6. R.J. Gutmann, et al., "CMP of Copper-Polymer Interconnect Structures," Ibid., p.257.
7. M.J.N. Pourbaix, Atlas of Chemical Equilibria in Aqueous Solutions, National Assoc. of Corrosion Engineers, Houston, Texas, 1974.
8. I.K. Iler, The Chemistry of Silica, John Wiley and Sons Inc., N.Y., 1979.
9. R.D. Letterman, (ed), Water Quality and Treatment, McGraw-Hill, N.Y., 1999, 5th Ed.
10. F. Morel, J. Hering, Principles and Applications of Aquatic Chemistry, John Wiley and Sons Inc., N Y., 1993.
11. B. Maag, "The Environmental Impact of Copper CMP," Masters Thesis, MIT, 2000.
12. Y. Sun, "Colloidal Chemical Investigations Pertaining to Copper CMP," Ph.D. Thesis, Univ. of Ariz., 2000.
13. B.M. Belongia, et al., "Treatment of Alumina and Silica CMP Waste by Electrocoagulation and Electrodecantation," J. Electrochem. Soc., 146, 1999, p.4124.
14. M. Reker, M. Lenart, S. Harnsberger, "Treatment and Water Recycling of Copper CMP Slurry Waste Streams to Achieve Compliance for Copper and Suspended Solids," Semiconductor Fabtech, 8th Ed., p. 141.
15. J.H Golden, "CMP Wastewater Treatment," Proc. CMP-MIC Conference, 2000, p.305, (also see: US 05871648).
16. R. Eisler, "Copper Hazards to Fish, Wildlife, and Invertebrates: A Synoptic Review," U. S. Geologícal Survey, 1997-0002. (Order via phone: 301-497-5550).
17. A. Hulanicki, "Complexation Reactions of Dithiocarbamates," Talanta Review, V. 14, pp. 1371-1392.
18. L. Mendecino, et al., "Environmental Impact of Process Tools," SEMICON/West, 1999.
19. L. Kirman, "Copper Removal from CMP Wastewater," CMP Users Group, NCCAVS, SEMATECH, ERC, April 1998.
20. Personal communication, Mr. Keith Silva, EPA Region 9, Phone: 415-744-1907. Also see: www.epa.gov/docs/epacfr40/chapt-1.info/subch-N/.