Reaction characteristics between Cu thin film and RF inductively coupled Cl2 plasma without/with UV irradiation

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 7, 1998, Pages 4103-4108

  Kwon, Myoung Seok ^a   Lee, Jeong Yong ^a   Choi, Kang Sik ^a   Han, Chul Hi ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Cl2 plasma; Copper; Copper chlorination; Etch reaction; Inductively coupled plasma; Ultraviolet irradiation

Indexed keywords

CHLORINATION; COPPER; IRRADIATION; PLASMA APPLICATIONS; PLASMAS; ULTRAVIOLET RADIATION;

ETCH REACTION;

ETCHING;

EID: 0032115371     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.4103     Document Type: Article

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