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Volumn 23, Issue 5, 2000, Pages 60-62,-64,-66,-68
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ECP technology faces chemical, dielectric hurdles
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
CHEMICAL VAPOR DEPOSITION;
COPPER;
DIELECTRIC MATERIALS;
ELECTROCHEMISTRY;
ELECTROPLATING;
INTEGRATED CIRCUIT LAYOUT;
PRINTED CIRCUIT BOARDS;
RELIABILITY;
ELECTRICAL RELIABILITY;
ELECTROCHEMICAL PLATING;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0033733229
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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