Micromachined thermally based CMOS microsensors

Proceedings of the IEEE

Volumn 86, Issue 8, 1998, Pages 1660-1678

  Baltes, Henry ^a   Paul, Oliver ^b   Brand, Oliver ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Chemical sensor; Cmos microsensors; Flow sensor; Heat capacity; Infrared sensor; Micromachining; Position sensor; Pressure sensor; Seebeck coefficient; Thermal conductivity; Thermal converter; Thermal sensor; Thermopile. 1998 ieee

Indexed keywords

CHEMICAL SENSORS; CMOS INTEGRATED CIRCUITS; DEPOSITION; INFRARED DEVICES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SPECIFIC HEAT; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES; THERMOPILES;

CMOS MICROSENSOR; SEEBECK COEFFICIENT; THERMAL CONVERTER;

SENSORS;

EID: 0032141810     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.704271     Document Type: Article

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