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Volumn , Issue , 1997, Pages 203-208
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Test structures to measure the heat capacity of CMOS layer sandwiches
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Author keywords
[No Author keywords available]
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Indexed keywords
DIELECTRIC MATERIALS;
INTEGRATED CIRCUIT LAYOUT;
INTEGRATED CIRCUIT TESTING;
MICROMACHINING;
SPECIFIC HEAT OF SOLIDS;
THERMAL VARIABLES MEASUREMENT;
HEAT CAPACITY TEST STRUCTURES;
CMOS INTEGRATED CIRCUITS;
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EID: 0030644320
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (11)
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