Thermoelectric test structures to measure the heat capacity of CMOS layer sandwiches

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 619-622

  von Arx, M ^a   Paul, O ^a   Baltes, H ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; MICROMACHINING; PASSIVATION; SPECIFIC HEAT OF SOLIDS; THERMOELECTRICITY; THIN FILMS; TRANSDUCERS;

THERMAL MICROTRANSDUCERS;

CMOS INTEGRATED CIRCUITS;

EID: 0030702596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)