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Volumn 99, Issue 4, 2011, Pages

Effects of silica particles on the electrical percolation threshold and thermomechanical properties of epoxy/silver nanocomposites

(7) Nam, Seungwoong a,b Woo Cho, Hyun c Kim, Taeho a Kim, Daeheum b June Sung, Bong c Lim, Soonho a Kim, Heesuk a

a Korea Institute of Science and Technology (South Korea)

b Kwangwoon University (South Korea)

c Sogang University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONDUCTIVITY; ELECTRICAL PERCOLATION; ELECTRICAL PERCOLATION THRESHOLD; ELECTRICAL RESISTIVITY; INTERMOLECULAR INTERACTIONS; MOLECULAR SIMULATIONS; ORDERS OF MAGNITUDE; SILICA PARTICLES; SILVER NANOPARTICLES; THERMOMECHANICAL PROPERTIES;

COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC PROPERTIES; NANOCOMPOSITES; NANOPARTICLES; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); PERCOLATION (SOLID STATE); SILICA; SOLVENTS; THERMAL EXPANSION;

SILVER;

EID: 79961080129 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3615690 Document Type: Article

Times cited : (37)

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