High conductivity of isotropic conductive adhesives filled with silver nanowires

International Journal of Adhesion and Adhesives

Volumn 26, Issue 8, 2006, Pages 617-621

  Wu, H P ^a   Liu, J F ^a   Wu, X J ^a   Ge, M Y ^a   Wang, Y W ^a   Zhang, G Q ^a,b   Jiang, J Z ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b ZHEJIANG SCI TECH UNIVERSITY   (China)

Author keywords

Composites; Mechanical properties of adhesives; Novel adhesives; Silver nanowires

Indexed keywords

HYDROLYSIS; MICROELECTRONIC PROCESSING; NANOSTRUCTURED MATERIALS; SILVER; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ISOTROPIC CONDUCTIVE ADHESIVES (ICA); MICROELECTRONIC PACKAGING; NOVEL ADHESIVES; SILVER NANOWIRES;

ADHESIVES;

ADHESIVES;

EID: 33745197112     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2005.10.001     Document Type: Article

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