SCOPUS 정보 검색 플랫폼

Science China Technological Sciences

Volumn 55, Issue 1, 2012, Pages 28-33

Influence of filler morphology on percolation threshold of isotropical conductive adhesives (ICA)

(6) Tao, Yu a,b Yang, Zhenguo a Lu, Xiaolu b Tao, Guoliang b Xia, Yanping b Wu, Haiping b

a FUDAN UNIVERSITY (China)

b CHANGZHOU UNIVERSITY (China)

Author keywords

aspect ratio; ICA; percolation threshold; simulation

Indexed keywords

ADHESIVES; FILLERS; INDEPENDENT COMPONENT ANALYSIS; MORPHOLOGY; NANORODS; NANOSTRUCTURED MATERIALS; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); SOLVENTS;

CHARACTERIZATION METHODS; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; CONDUCTIVITY PERCOLATION THRESHOLD; PERCOLATION THRESHOLDS; REDUCTION METHOD; SIMULATED RESULTS; SIMULATION;

ASPECT RATIO;

EID: 84863066219 PISSN: 16747321 EISSN: 18691900 Source Type: Journal
DOI: 10.1007/s11431-011-4651-2 Document Type: Article

Times cited : (24)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.