Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 5, 2010, Pages 486-490

  Chen, Dapeng ^a   Qiao, Xueliang ^a   Qiu, Xiaolin ^b   Tan, Fatang ^a   Chen, Jianguo ^a   Jiang, Renzhi ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NANCHANG INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE STRENGTH; CONDUCTIVE FILLERS; ELECTRICAL CONDUCTANCE; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH CONDUCTIVITY; HIGH FILLER; N VINYLPYRROLIDONE; SILVER NANOSTRUCTURES; SILVER NITRATES; SIMPLE METHOD;

ADHESIVES; CHEMICAL PROPERTIES; ELECTRIC CONDUCTANCE; ETHANOL; ETHYLENE; ETHYLENE GLYCOL; FILLERS; NANOSTRUCTURES;

SILVER;

EID: 77953324235     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9943-y     Document Type: Article

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