Silver surface iodination for enhancing the conductivity of conductive composites

Advanced Functional Materials

Volumn 20, Issue 16, 2010, Pages 2580-2587

  Yang, Cheng ^a   Xie, Yu Tao ^a   Yuen, Matthew Ming Fai ^a   Xu, Bing ^a   Gao, Bo ^a   Xiong, Xiaomin ^b   Wong, C P ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN YAT SEN UNIVERSITY   (China)

^c Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; ELECTRIC CONDUCTIVITY; FILLERS; NANOCLUSTERS; RADIO FREQUENCY IDENTIFICATION (RFID); SECONDARY ION MASS SPECTROMETRY; SILVER OXIDES; SOLVENTS; SURFACE CHEMISTRY; SURFACE TREATMENT;

CONDUCTIVE ADHESIVE; CONDUCTIVE COMPOSITES; ELECTRICAL CONDUCTIVITY; FILLER SURFACE TREATMENT; FOUR-POINT PROBE METHOD; PERCOLATION THRESHOLDS; PRINTED ELECTRONICS; THIN FILM RESISTORS;

SILVER HALIDES;

EID: 77956043887     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201000673     Document Type: Article

References (39)

1. Y. Li, K. S. Moon, C. P. Wong, Science 2005, 308, 1419.
2. L. R. Bao, B. Wei, A. Y. Xiao, IEEE Electron. Compon. Technol. Conf. 2007, 57, 494.
3. D. Stauffer, A. Aharony, Introdudion to Percolation Theory, 2nd ed., Taylor & Francis, LondonUK 1992, Ch. 1.
4. R. Strumpler, J. Glatz-Reichenbach, J. Eledroceram. 1999, 3, 329.
5. K. Chatterjee, S. Banerjee, D. Chakravorty, Europhys. Lett. 2004, 66, 592.
6. J. Liu, Condudive Adhesivesfor Eledronics Packaging, Electrochemical Publications, Port Erin, Isle of Man, UK 1999
7. H. J. Jiang, K. S. Moon, Y. Li, C. P. Wong, Chem. Mater. 2006, 18, 2969.
8. S. Sivaramakrishnan, P. J. Chia, Y. C. Yeo, L. L Chua, P. K. H. Ho, Nat. Mater. 2007, 6, 149.
9. C. Yang, B. Xu, M. M. F. Yuen, 58th IEEE Electron. Compon. Technol. Conf. 2008, 5, 213.
10. C. R. Ruschau, S. Yoshikawa, R. E. Newnham, J. Appl. Phys. 1992, 72, 953.
11. Y. Li, A. Whitman, K. S. Moon, C. P. Wong, Proc. Eletron. Compon. Technol. Conf. 2005, 2, 1648.
12. Y. B. Yi, Phys. Rev. E 2006, 74, 031112.
13. Y. B. Yi, E. Tawerghi, Phys. Rev. E 2009, 79, 041134.
14. P. Boolchand, W. J. Bresser, Nature 2001, 410, 1070.
15. M. Tatsumisago, Y. Shinkuma, T. Minami, Nature 1991, 354, 217.
16. K. Matsunaga, I. Tanaka, H. Adachi, J. Phys. Soc. Jpn. 1998, 67, 2027.
17. U. Hasse, S. Fletcher, F. Scholz, J. Solid State Eledrochem. 2006, 10, 833.
18. B. V. Andryushechkin, C. M. Zhidomirov, K. N. Eltsov, Y. V. Hladchanka, A. A. Korlyukov, Phys. Rev. B 2009, 80, 10.
19. U. Hasse, F. Scholz, Eledrochem. Commun. 2004, 6, 409.
20. B. Wiley, Y. G. Sun, Y. Xia, Acc. Chem. Res. 2007, 40, 1067.
21. P. L. Redmond, A. J. Hallock, L E. Brus, Nano Lett. 2005, 5, 131.
22. Y. G. Sun, B. Mayers, T. Herricks, Y. N. Xia, Nano Lett. 2003, 3, 955.
23. Y. L. Wang, P. H. C. Camargo, S. E. Skrabalak, H. C. Cu, Y. N. Xia, Langmuir 2008, 24, 12042.
24. R. W. Home, M. N. McMorris, R. H. Ottewill, J. Photogr. Sci. 1962, 10, 235.
25. V. Bonacic-Koutecky, R. Mitric, Chem. Rev. 2005, 105, 11.
26. J. Hagen, L. D. Socaciu, J. Le Roux, D. Popolan, T. M. Bernhardt, L. Woste, R. Mitric, H. Noack, V. Bonacic-Koutecky, J. Am. Chem. Soc. 2004, 126, 3442.
27. M. S. Sibbald, C. Chumanov, T. M. Cotton, J. Eletroanal. Chem. 1997, 438, 179.
28. X. Zhang, S. Stewart, D. W. Shoesmith, J. C. Wren, J. Eletrochem. Soc. 2007, 154, F70.
29. F. Fourcade, T. Tzedakis, A. Bergel, Chem. Eng. Sci. 2003, 58, 3507.
30. K. C. Patil, C. N. R. Rao, Lacksone. Jw, C. E. Dryden, J. Inorg. Nucl. Chem. 1967, 29, 407.
31. A. J. Bard, R. Parsons, J. Jordan, Standard Potentials in Aqueous Solution, Marcell Dekker, Inc., New York 1985
32. K. Arai, F. Kusu, N. Noguchi, K. Takamura, H. Osawa, Anal. Biochem. 1996, 240, 109.
33. M. Hepel, M. Tomkiewicz, J. Eletrochem. Soc. 1984, 131, 1288.
34. P. S. Kumar, C. S. Sunandana, Proc. SPIE 2001, 4807, 241.
35. Y. Wang, Q. Sun, K. N. Fan, J. F. Deng, Chem. Phys. Lett. 2001, 334, 411.
36. U. Bardi, G. Rovida, Surf. Sci. 1983, 128, 145.
37. P. A. Thiel, M. Shen, D. J. Liu, J. W. Evans, J. Phys. Chem. C 2009, 113, 5047.
38. P. V. Nikitin, S. Lam, K. V. S. Rao, IEEE Antennas and Propagation Society International Symposium, 2005, 2B, 353.
39. The addition level of iodine (halogen) content is compatible with electronics industry standard, IEC 61249-2-21, for the requirements of halogen free materials.