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Volumn 25, Issue 13, 2011, Pages 1465-1480

The sintering behavior of electrically conductive adhesives filled with surface modified silver nanowires

Author keywords

Conductive adhesives; curing; resistivity; silver nanowires; sinter

Indexed keywords

CONDUCTIVE ADHESIVE; CURING CONDITION; DICARBOXYLIC ACID; ELECTRICAL PROPERTY; ELECTRICALLY CONDUCTIVE ADHESIVES; FUNCTIONALIZED; HIGH SOLID CONTENT; HIGHER TEMPERATURES; PARTIAL EVAPORATION; POLYMER COMPONENTS; POLYOL PROCESS; SILVER NANOWIRES; SINTER; SINTERING BEHAVIORS; SURFACE-MODIFIED; VOLUME RESISTIVITY; WEIGHT RATIOS;

EID: 80052063667     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/016942410X549924     Document Type: Article
Times cited : (55)

References (27)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.