Onset of electrical conduction in isotropic conductive adhesives: A general theory

Materials Science in Semiconductor Processing

Volumn 2, Issue 4, 1999, Pages 309-319

  Mikrajuddin, A ^a   Shi, F G ^b   Chungpaiboonpatana, S ^b   Okuyama, K ^a   Davidson, C ^c   Adams, J M ^c  

^a HIROSHIMA UNIVERSITY   (Japan)

^b University of California at Irvine   (United States)

^c Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; MATHEMATICAL MODELS; METAL INSULATOR BOUNDARIES; PARTICLE SIZE ANALYSIS; PERCOLATION (SOLID STATE); PRESSURE EFFECTS; VOLUME FRACTION;

EFFECTIVE MEDIUM APPROXIMATION (EMA); ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);

ADHESIVES;

EID: 0033297326     PISSN: 13698001     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-8001(99)00035-9     Document Type: Article

References (39)

1. Li L., Morris J.E. IEEE Trans. Comp. Packag. Manufact. Technol. A. 20:1997;3.
2. Lai Z., Liu J. IEEE Trans. Comp. Packag. Manufact. Technol. B. 19:1996;644.
3. Burkov A.T., Heirich A., Gladun C., Pitschke W., Schumann J. J. Phys. Rev. B. 58:1998;9644.
4. Hirano S., Kishimoto A. Jpn J. Appl. Phys. 37:1998;L1190.
5. Chelzard A., McRae E., Mareche J.F., Furdin G., Sundqvist B. J. Appl. Phys. 83:1998;1410.
6. Dziedzic A., Magiera A., Winsiewski R. Microelectron Reliability. 38:1998;1893.
7. Chelidze T., Gueguen Y. J. Phys. D: Appl. Phys. 31:1998;2877.
8. Rusu F., Chiriac H., Lozovan M., Urse M. Sensors and Actuators A. 67:1998;170.
9. Vittal N., Aiyer R.C., Aiyer C.R., Setty M.S., Phadke S.D., Karekar R.N. J. Appl. Phys. 64:1988;5244.
10. Mikrajuddin, Shi FG, Chungpaiboonpatana S, Okuyama K, Davidson C, Adams JM. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Georgia, 1999.
11. Shi FG, Mikrajuddin, Chungpaiboonpatana S, Okuyama K, Davidson C, Adams JM. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Georgia, 1999.
12. Shi FG, Mikrajuddin, Chungpaiboonpatana S, Okuyama K, Davidson C, Adams JM. Conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles. Mater Sci Semi Processing (in press), 1999.
13. Bruggemann D.A. Ann. Phys. (Leipzig). 24:1935;636.
14. Landauer R. J. Appl. Phys. 23:1952;779.
15. Bueche F. J. Appl. Phys. 43:1972;4837.
16. Springett B.E. J. Appl. Phys. 44:1973;2925.
17. Mantesse J.V., Curtin W.A., Webb W.W. Phys. Rev. B. 33:1996;7897.
18. Kirkpatrick S. Phys. Rev. Lett. 27:1971;1722.
19. Bergmann D.J., Stroud D. Solid State Physics. 46:1992;148.
20. Ehrenheich H., Schwartz L.M. Solid State Physics. 31:1976.
21. Sancaktar E., Wei Y. J. Adhesion Sci. Technol. 10:1996;1221.
22. Miyasaka K., et al. J. Mater. Sci. 17:1982;1610.
23. Trusov L.I., Askuntovich N.G., Borovikova R.P., Baklastov M.A., Vedotov V.P. Phys. Lett. A. 167:1992;306.
24. Yu Dovzhenko A., Zhirkov P.V. Phys. Lett. A. 204:1995;247.
25. Last B.J., Thouless D.J. Phys. Rev. Lett. 27:1971;1719.
26. Genetti W.B., Yuan W.L., Grady B.P., O'Rear E.A., Lai C.L., Glatzhofer D.T. J. Mater. Sci. 33:1998;3085.
27. Holm R. Electric contacts. 1967;Springer-Verlag, Berlin.
28. Mikrajuddin, Shi FG, Kim HK, Okuyama K. Size-dependent electrical constriction resistance: a general analytical formula (submitted for publication to Mater Sci Semi Processing), 1999.
29. Sharvin Y.V. Sov. Phys. JETP. 21:1965;655.
30. Mott N. Metal-insulator transitions. 1990;Taylor and Francis, London.
31. Ruschau G.R., Yoshikawa S., Newnham R.E. J. Appl. Phys. 72:1992;953.
32. Wood D.M. Phys. Rev. Lett. 46:1981;749.
33. Sze S.M. Physics of semiconductor devices. 1981;Wiley, New York.
34. Kittel C. Introduction to solid state physics. 7th ed. 1996;Wiley, New York.
35. Lide D.R. Handbook of chemistry and physics. 74th ed. 1993;CRC Press, Boca Raton.
36. Ku C.C., Liepins R. Electrical properties of polymers. 1987;Hanser, Munich.
37. Pieke G.E., Seager C.H. Phys. Rev. B. 10:1974;1421.
38. Neufeld C.N., Rieder W.F. IEEE Trans. Comp. Packag. Manufact. Technol. A. 18:1995;399.
39. Malliaris A., Turner D.T. J. Appl. Phys. 42:1971;614.