Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives

Microelectronics Reliability

Volumn 51, Issue 7, 2011, Pages 1230-1234

  Marcq, F ^a   Demont, P ^a   Monfraix, P ^b   Peigney, A ^a   Laurent, Ch ^a   Falat, T ^c   Courtade, F ^d   Jamin, T ^d  

^a UNIVERSITÉ PAUL SABATIER   (France)

^b THALES ALENIA SPACE   (France)

^c WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^d CNES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL CONDUCTIVITY; FILLED EPOXY RESINS; HIGH ELECTRICAL CONDUCTIVITY; HYBRID COMPOSITES; HYBRID CONDUCTIVE ADHESIVES; MICRO AND NANOFILLERS; MICRO-SIZED SILVER FLAKES; NANOMETRICS; ROOM TEMPERATURE; RUBBERY STATE; SILVER LOADING; STORAGE MODULI; SYNERGISTIC EFFECT;

ADHESIVES; AGGLOMERATION; CARBON NANOTUBES; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; SILVER;

EPOXY RESINS;

EID: 79958162274     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.03.020     Document Type: Conference Paper

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