Recent advances on electrically conductive adhesives

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 696-704

  Zhang, Rongwei ^a,b   Agar, Josh C ^b   Wong, C P ^a,b,c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT CARRYING CAPABILITY; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGING; ENVIRONMENTAL FRIENDLINESS; FINE-PITCH CAPABILITY; IMPACT PERFORMANCE; ISOTROPICALLY CONDUCTIVE ADHESIVES; LEAD-FREE; LOW STRESS; PROCESSING CONDITION; PROCESSING COSTS; PROCESSING STEPS; RELIABILITY PROPERTIES; RELIABILITY TEST; RESEARCH EFFORTS; SOLDER JOINTS;

CLEANING; CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; METAL CLEANING; PACKAGING; RELIABILITY; TECHNOLOGY;

ELECTRIC PROPERTIES;

EID: 79951934494     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702728     Document Type: Conference Paper

References (65)

1. Zhang, R.W., Agar, J.C., and Wong, C.P., "Conductive polymer composites," Encyclo. Poly. Sci. Technol., in press.
2. Li, Y., Moon, K.-s., and Wong, C.P., "Electronics without lead," Science, Vol. 308, No. 5727 (2005), pp. 1419-1420.
3. Li, Y. and Wong, C.P., "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications," Mater. Sci. & Eng., R: Reports, Vol. R51, No. 1-3 (2006), pp. 1-35.
4. Mir, I. and Kumar, D., "Recent advances in isotropic conductive adhesives for electronics packaging applications," Int. J. Adhes. Adhes., Vol. 28, No. 7 (2008), pp. 362-371.
5. Yim, M.J., Li, Y., Moon, K.-s., Paik, K.W., and Wong, C.P., "Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging," J. Adhes. Sci. Technol., Vol. 22, No. 14 (2008), pp. 1593-1630.
6. Lu, D.D. and Wong, C.P., "Recent advances in developing high performance isotropic conductive adhesives," J. Adhes. Sci. Technol., Vol. 22, No. 8-9 (2008), pp. 835-851.
7. Liu, J., Conductive adhesives for electronics packaging, Electrochemical Publications Ltd. (UK, 1999).
8. Lau, J.H., Wong, C.P., Lee, N.C., and Ricky, S.W., Electronics manufacturing with lead-free, halogen-free & Conductive-adhesive materials, Mcgraw-Hill Companies (New York, 2003).
9. Hwang, J.S., Environmental-friendly electronics: lead-free technology, Electrochemical publications Ltd., (Asahi House, 2001).
10. Liu, J., "ACA bonding technology for low cost electronics packaging applications - current status and remaining challenges," Soldering Surf. Mount Technol., Vol. 13, No. 3 (2001), pp. 39-57.
11. Zhang, R., Lin, W., Moon, K.-S., and Wong, C.P., "Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications " Int. J. Adhes. Adhes., Vol. 30, No. 6 (2010), pp. 403-407.
12. Wong, C.P., Lin, W., Zhu, L., Jiang, H., Zhang, R., Li, Y., and Moon, K., "Nano materials for microelectronic and photonic packaging," Front. Optoelectron. China, Vol. 3, No. 2 (2010), pp. 139-142.
13. th Electronic Components & Technology Conf, San Diego, CA, May. 2009, pp. 1479-1485.
14. th Electronic Components & Technology Conf, San Diego, CA, May. 2009, pp. 1356-1360.
15. th Electronic Components & Technology Conf, Las Vagas, NV, June. 2010, pp. 1713-1718.
16. Zhang, R., Lin, W., Moon, K.-s., and Wong, C.P., "Fast Preparation of Printable Highly Conductive Polymer Nanocomposites by Thermal Decomposition of Silver Carboxylate and Sintering of Silver Nanoparticles," ACS Appl. Mater. Interfaces, Vol. 2, No. 9 (2010), pp. 2637-2645.
17. Goh, C.F., Yu, H., Yong, S.S., Mhaisalkar, S.G., Boey, F.Y.C., and Teo, P.S., "The effect of annealing on the morphologies and conductivities of sub-micrometer sized nickel particles used for electrically conductive adhesive," Thin Solid Films, Vol. 504, No. 1-2 (2006), pp. 416-420.
18. th Electronic Components & Technology Conf, Las Vagas, NV, June. 2010,, pp. 1226-1230.
19. Gilleo, K. and in: Huang, J.s.E., Environment-friendly electronics: lead-free technology, Electrochemical Publications Ltd., (Port Erin, 2001), Chapter 24.
20. Ruschau, G.R., Yoshikawa, S., and Newnham, R.E., "Resistivities of conductive composites," J. Appl. Phys., Vol. 72, No. 3 (1992), pp. 953-9.
21. Zhang, R., Li, Y., Yim, M.J., Moon, K.S., Lu, D.D., and Wong, C.P., "Enhanced electrical properties of anisotropic conductive adhesive with pi-conjugated self-assembled molecular wire junctions," IEEE Trans. Compon. Packag. Technol., Vol. 32, No. 3 (2009), pp. 677-683.
22. th Electronic Components & Technology Conf, San Diego, CA, May 2009, pp. 2034-2038.
23. Chmutin, I.A., Letyagin, S.V., Shevchenko, V.G., and Ponamorcnko, A.T., "Conductive Polymer Composites: Structure, Contact Phenomena, and Anisotropy," Vysokomol. Soedin. Ser. A, Vol. 36, 1994),
24. Roldughin, V.I. and Vysotskii, V.V., "Percolation properties of metal-filled polymer films, structure and mechanisms of conductivity," Prog. Org. Coat., Vol. 39, No. 2-4 (2000), pp. 81-100.
25. Gul, V.E., New concepts in polymer science: structure and properties of conducting polymer composites, VSP, (Utrecht, The Netherlands, 1996).
26. Gilleo, K., "Assembly with conductive adhesives," Soldering Surf. Mount Technol., Vol. 19, (1995), pp. 12-17.
27. Harris, P.G., "Conductive adhesives: A critical review of progress to date," Soldering Surf. Mount Technol., Vol. 20, (1995), pp. 19-21, 26.
28. Wu, H.P., Liu, J.F., Wu, X.J., Ge, M.Y., Wang, Y.W., Zhang, G.Q., and Jiang, J.Z., "High conductivity of isotropic conductive adhesives filled with silver nanowires," Int. J. Adhes. Adhes., Vol. 26, No. 8 (2006), pp. 617-621.
29. Tao, Y., Xia, Y., Wang, H., Gong, F., Wu, H., and Tao, G., "Novel isotropical conductive adhesives for electronic packaging application," IEEE Trans. Adv. Packag., Vol. 32, No. 3 (2009), pp. 589-592.
30. Chen, C., Wang, L., Li, R., Jiang, G., Yu, H., and Chen, T., "Effect of silver nanowires on electrical conductance of system composed of silver particles," J. Mater. Sci., Vol. 42, No. 9 (2007), pp. 3172-3176.
31. Lin, X. and Lin, F., "The improvement on the properties of silver-containing conductive adhesives by the addition of carbon nanotube," Proc. 6th the IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, June, 2004, pp. 382-384.
32. Oh, Y., Suh, D., Kim, Y., Lee, E., Mok, J.S., Choi, J., and Baik, S., "Silver-plated carbon nanotubes for silver/conducting polymer composites," Nanotechnology, Vol. 19, No. 49 (2008), pp. 495602/1-495602/7.
33. Lee, H.-H., Chou, K.-S., and Shih, Z.-W., "Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives," Int. J. Adhes. Adhes., Vol. 25, No. 5 (2005), pp. 437-441.
34. Ye, L., Lai, Z., Liu, J., and Tholen, A., "Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives," IEEE Trans. Electron. Packag. Manuf., Vol. 22, No. 4 (1999), pp. 299-302.
35. Zhang, R., Moon, K.-s., Lin, W., and Wong, C.P., "Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles," J. Mater. Chem., Vol. 20, No. 10 (2010), pp. 2018-2023.
36. Jiang, H., Moon, K.-S., Lu, J., and Wong, C.P., "Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization," J. Electron. Mater., Vol. 34, No. 11 (2005), pp. 1432-1439.
37. Jiang, H., Moon, K.-S., Li, Y., and Wong, C.P., "Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites," Chem. Mater., Vol. 18, No. 13 (2006), pp. 2969-2973.
38. th Electronic Components & Technology Conf, San Diego, CA, May. 2009, pp. 150-154.
39. Iwama, S. and Sahashi, T., "Sintering of ultrafine metal powders. I. Coalescence growth stage of gold and silver," Jpn. J. Appl. Phys., Vol. 19, No. 6 (1980), pp. 1039-1044.
40. Bai, J.G., Lei, T.G., Calata, J.N., and Lu, G.-Q., "Control of nanosilver sintering attained through organic binder burnout," J. Mater. Res., Vol. 22, No. 12 (2007), pp. 3494-3500.
41. Silvert, P.-Y., Herrera-Urbina, R., Duvauchelle, N., Vijayakrishnan, V., and Elhsissen, K.T., "Preparation of colloidal silver dispersions by the polyol process. Part 1. Synthesis and characterization," J. Mater. Chem., Vol. 6, No. 4 (1996), pp. 573-577.
42. Kvitek, L., Panacek, A., Soukupova, J., Kolar, M., Vecerova, R., Prucek, R., Holecova, M., and Zboril, R., "Effect of surfactants and polymers on stability and antibacterial activity of silver nanoparticles (NPs)," J. Phys. Chem. C, Vol. 112, No. 15 (2008), pp. 5825-5834.
43. Xiong, Y., Siekkinen, A.R., Wang, J., Yin, Y., Kim, M.J., and Xia, Y., "Synthesis of silver nanoplates at high yields by slowing down the polyol reduction of silver nitrate with polyacrylamide," J. Mater. Chem., Vol. 17, No. 25 (2007), pp. 2600-2602.
44. Chen, M., Wang, L.-Y., Han, J.-T., Zhang, J.-Y., Li, Z.- Y., and Qian, D.-J., "Preparation and Study of Polyacryamide-Stabilized Silver Nanoparticles through a One-Pot Process," J. Phys. Chem. B, Vol. 110, No. 23 (2006), pp. 11224-11231.
45. Yamamoto, M., Kashiwagi, Y., and Nakamoto, M., "Size-Controlled Synthesis of Monodispersed Silver Nanoparticles Capped by Long-Chain Alkyl Carboxylates from Silver Carboxylate and Tertiary Amine," Langmuir, Vol. 22, No. 20 (2006), pp. 8581-8586.
46. Yamamoto, M. and Nakamoto, M., "Novel preparation of monodispersed silver nanoparticles via amine adducts derived from insoluble silver myristate in tertiary alkylamine," J. Mater. Chem., Vol. 13, No. 9 (2003), pp. 2064-2065.
47. Kotthaus, S., Guenther, B.H., Haug, R., and Schaefer, H., "Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles," IEEE Trans Compon. Packag. Manuf. Technol., Part A, Vol. 20, No. 1 (1997), pp. 15-20.
48. Dong, T.-Y., Chen, W.-T., Wang, C.-W., Chen, C.-P., Chen, C.-N., Lin, M.-C., Song, J.-M., Chen, I.-G., and Kao, T.-H., "One-step synthesis of uniform silver nanoparticles capped by saturated decanoate: direct spray printing ink to form metallic silver films," Phys. Chem. Chem. Phys., Vol. 11, No. 29 (2009), pp. 6269-6275.
49. Nguyen, B.T., Gautrot, J.E., Nguyen, M.T., and Zhu, X.X., "Nitrocellulose-stabilized silver nanoparticles as low conversion temperature precursors useful for inkjet printed electronics," J. Mater. Chem., Vol. 17, No. 17 (2007), pp. 1725-1730.
50. Das, R.N., Egitto, F.D., and Markovich, V.R., "Nano- and micro-filled conducting adhesives for z-axis interconnections: new direction for high-speed, high-density, organic microelectronics packaging," Circuit World, Vol. 34, No. 1 (2008), pp. 3-12.
51. nd international conference o adhesive joining and coating technology in electronics manufacturing, Stockholm, Sweden, 1996.
52. Lu, D., Tong, Q.K., and Wong, C.P., "Mechanisms underlying the unstable contact resistance of conductive adhesives," IEEE Trans. Electron. Packag. Manuf., Vol. 22, No. 3 (1999), pp. 228-232.
53. Antoon, M.K., Koenig, J.L., and Serafini, T., "Fourier-transform infrared study of the reversible interaction of water and a crosslinked epoxy matrix," J. Polym. Sci., Polym. Phys. Ed., Vol. 19, No. 10 (1981), pp. 1567-75.
54. Antoon, M.K. and Koenig, J.L., "Irreversible effects of moisture on the epoxy matrix in glass-reinforced composites," J. Polym. Sci., Polym. Phys. Ed., Vol. 19, No. 2 (1981), pp. 197-212.
55. Lu, D. and Wong, C.P., "Novel conductive adhesives for surface mount applications," J. Appl. Polym. Sci., Vol. 74, No. 2 (1999), pp. 399-406.
56. Leidheiser, H., Jr., "Mechanism of corrosion inhibition with special attention to inhibitors in organic coatings," J. Coat. Technol., Vol. 53, No. 678 (1981), pp. 29-39.
57. Reardon, P.A., in Corrosion'86 (Paper No. 175), Natural Association of Corrosion Engineers, Houston, TX., 1986,
58. Reardon, P.A. and Bernahl, W.E., in Corrosion'87 (Paper No. 438), Natural Association of Corrosion Engineers, Houston, TX., 1987,
59. Noack, M.G., "in Corrosion'89 (Paper No. 436), Natural Association of Corrosion Engineers, Houston, TX.," 1989,
60. Romaine, S., in Proceedings of the America Power Conference, Chicago, IL, Apr. 1986, pp. 1066-1073.
61. Love, J.C., Estroff, L.A., Kriebel, J.K., Nuzzo, R.G., and Whitesides, G.M., "Self-Assembled Monolayers of Thiolates on Metals as a Form of Nanotechnology," Chem. Rev., Vol. 105, No. 4 (2005), pp. 1103-1169.
62. Moon, K.-S., Liong, S., Li, H., and Wong, C.P., "Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials," J. Electron. Mater., Vol. 33, No. 11 (2004), pp. 1381-1388.
63. Li, H., Moon, K.-S., and Wong, C.P., "A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces," J. Electron. Mater., Vol. 33, No. 2 (2004), pp. 106-113.
64. Gallagher, C., Matijasevic, G., and Capote, M.A., "Transient liquid phase sintering conductive adhesives for mechanical, electrical and thermal interconnects," US Patent 5853622, 1998.
65. Lu, D. and Wong, C.P., "Isotropic conductive adhesives filled with low-melting-point alloy fillers," IEEE Trans Electron. Packag. Manuf., Vol. 23, No. 3 (2000), pp. 185-190.