Copper conductive adhesives for printed circuit interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1651-1655

  Qi, Siyuan ^a   Litchfield, Robert ^a   Hutt, David A ^a   Vaidhyanathan, Bala ^a   Liu, Changqing ^a   Webb, Patrick ^b   Ebbens, Stephen ^c  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Manufacturing Technology Centre   (United Kingdom)

^c UNIVERSITY OF SHEFFIELD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE RESINS; AMBIENT CONDITIONS; CONDUCTIVE ADHESIVE; CURED MATERIALS; ELECTRICAL CONDUCTIVITY; ELECTRICAL PERFORMANCE; FILLED ADHESIVES; FUNCTIONAL CIRCUITS; GLASS SUBSTRATES; GOOD STABILITY; HIGH CONDUCTIVITY; INERT ATMOSPHERES; ISOTROPICALLY CONDUCTIVE ADHESIVES; LOW COSTS; PRINTED CIRCUIT INTERCONNECTS; PRINTED ELECTRONICS; PROTECTIVE ORGANIC COATINGS; RE-OXIDATION; SURFACE MOUNT COMPONENTS;

COPPER POWDER; CURING; ELECTRIC CONDUCTIVITY; IDENTIFICATION (CONTROL SYSTEMS); ORGANIC COATINGS; PRINTED CIRCUIT BOARDS; RESINS; SILVER; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

COPPER;

EID: 84866876834     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6249059     Document Type: Conference Paper

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