A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications

Composites Science and Technology

Volumn 71, Issue 4, 2011, Pages 528-534

  Zhang, Rongwei ^a   Moon, Kyoung sik ^b   Lin, Wei ^b   Agar, Josh C ^b   Wong, Ching Ping ^a,b,c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

A. Adhesive joints; A. Flexible composites; B. Electrical properties; D. Raman spectroscopy; E. Sintering

Indexed keywords

A. ADHESIVE JOINTS; A. FLEXIBLE COMPOSITES; B. ELECTRICAL PROPERTIES; D. RAMAN SPECTROSCOPY; E. SINTERING;

ADHESIVE JOINTS; CARBOXYLATION; COMPOSITE MATERIALS; CONDUCTIVE PLASTICS; COSTS; ELECTRIC CONDUCTIVITY; ETHERS; GLYCOLS; MECHANICAL PROPERTIES; POLYETHYLENE TEREPHTHALATES; POLYMERS; POLYPROPYLENE OXIDES; RAMAN SCATTERING; RAMAN SPECTROSCOPY; SINTERING; THERMOPLASTICS;

SILVER;

EID: 79951518317     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2011.01.001     Document Type: Article

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