Feature-scale simulations of particulate slurry flows in chemical mechanical polishing by smoothed particle hydrodynamics

Communications in Computational Physics

Volumn 16, Issue 5, 2014, Pages 1389-1418

  Wang, Dong ^a   Shao, Sihong ^b   Yan, Changhao ^a   Cai, Wei ^a,c   Zeng, Xuan ^a  

^a FUDAN UNIVERSITY   (China)

^b PEKING UNIVERSITY   (China)

^c UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE   (United States)

Author keywords

Abrasive concentration; Chemical mechanical polishing; Particulate flow; Rough pad; Smoothed particle hydrodynamics; Wafer defects

Indexed keywords

EID: 84907208267     PISSN: 18152406     EISSN: 19917120     Source Type: Journal    
DOI: 10.4208/cicp.261213.030614a     Document Type: Article

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