Modeling of chemical mechanical polishing processes using a discretized geometry approach

Journal of the Electrochemical Society

Volumn 147, Issue 4, 2000, Pages 1502-1512

  Yao, Chih Hsiang ^a   Feke, Donald L ^a   Robinson, Karl M ^b   Meikle, Scott ^b  

^a Case Western Reserve University   (United States)

^b MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HYDRODYNAMICS; MICROELECTRONICS; MORPHOLOGY; RHEOLOGY; SILICA; SILICON WAFERS; SLURRIES; SURFACE TOPOGRAPHY;

CHEMICAL MECHANICAL POLISHING; COLLOIDAL SILICA; MICROELECTRONIC MATERIALS PROCESSING; POLISHING ORBIT; POLISHING PAD;

CHEMICAL POLISHING;

EID: 0033741051     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393386     Document Type: Article

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