Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Applied Surface Science

Volumn 257, Issue 1, 2010, Pages 249-253

  Wang, Yongguang ^a   Zhao, Yongwu ^a   An, Wei ^a   Ni, Zifeng ^a   Wang, Jun ^a  

^a JIANGNAN UNIVERSITY   (China)

Author keywords

Abrasive concentration; Abrasive size; CMP; Modeling

Indexed keywords

ABRASIVES; BINDING ENERGY; DEFORMATION; MATERIALS PROPERTIES; MODELS; MOLECULES; PARTICLE SIZE; POLISHING; SLURRIES;

ABRASIVE CONCENTRATION; ABRASIVE PARTICLE SIZE; ABRASIVE SIZE; CHEMICAL MECHANICAL POLISHING(CMP); MICRO-CONTACT MECHANICS; OPERATIONAL CONDITIONS; PROBABILITY STATISTIC; SLURRY CONCENTRATION;

CHEMICAL MECHANICAL POLISHING;

EID: 77955514284     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2010.06.077     Document Type: Article

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