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Applied Physics A: Materials Science and Processing

Volumn 100, Issue 1, 2010, Pages 89-104

Molecular dynamics investigations on polishing of a silicon wafer with a diamond abrasive

(4) Agrawal, Paras M a Raff, L M b Bukkapatnam, S a Komanduri, R a

a Oklahoma State University (United States)

b OKLAHOMA STATE UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDINGS; CHIP FORMATIONS; CONVENTIONAL MATERIALS; CUTTING FORCES; DIAMOND ABRASIVE; DIFFERENT GEOMETRY; DRY CONDITION; MATERIAL REMOVAL; MATERIAL REMOVAL RATE; MD SIMULATION; PHENOMENOLOGICAL MODELS; RAKE ANGLE; SILICON ATOMS; THRUST FORCES; TRANSVERSE MOTIONS;

ABRASIVES; ATOMS; CHEMICAL BONDS; CHEMICAL POLISHING; CUTTING; DIAMONDS; MOLECULAR DYNAMICS; POLISHING; PROBABILITY; SEMICONDUCTING SILICON COMPOUNDS; WAFER BONDING;

SILICON WAFERS;

EID: 77954087086 PISSN: 09478396 EISSN: 14320630 Source Type: Journal
DOI: 10.1007/s00339-010-5570-y Document Type: Article

Times cited : (27)

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