Models of nanoparticles movement, collision, and friction in chemical mechanical polishing (CMP)

Journal of Nanoparticle Research

Volumn 14, Issue 3, 2012, Pages

  Ilie, Filip ^a  

^a UNIVERSITY POLITEHNICA OF BUCHAREST   (Romania)

Author keywords

CMP; Collision; Friction and wear; Interaction; Models; Nanoasperity; Nanoparticles

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; FRICTION; MODELS; NANOPARTICLES; SILICA; SURFACE TOPOGRAPHY; TOPOGRAPHY; WEAR OF MATERIALS;

CHEMICAL MECHANICAL POLISHING(CMP); CHEMICAL-MECHANICAL POLISHING PROCESS; COLLISION; FRICTION AND WEAR; HYDRODYNAMIC PRESSURE; INTEGRATED CIRCUIT MANUFACTURING; INTERACTION; NANOASPERITIES;

POLISHING;

NANOPARTICLE; SILICON DIOXIDE;

CHEMICAL ANALYSIS; CHEMICAL MECHANICAL POLISHING; CHEMICAL PARAMETERS; CHEMICAL REACTION; FRICTION; HYDRODYNAMICS; NANOANALYSIS; PREDICTIVE VALUE; PRIORITY JOURNAL; REVIEW; SOLID; SURFACE PROPERTY; TOPOGRAPHY;

EID: 84860438854     PISSN: 13880764     EISSN: 1572896X     Source Type: Journal    
DOI: 10.1007/s11051-012-0752-5     Document Type: Review

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