SPH-based flow simulation of polishing slurry including polished debris in CMP

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 73, Issue 1, 2007, Pages 90-95

  Takano, Kaoru ^a   Yamada, Koichiro ^a   Takezawa, Nobuhiro ^a   Suzuki, Tatsutoshi ^a   Inamura, Toyoshiro ^a  

^a NONE

Author keywords

CMP; Pad damage; Polished debris; Polished surface; Simulation; Slurry flow; SPH

Indexed keywords

CMP; PAD DAMAGE; POLISHED SURFACES; SIMULATION; SLURRY FLOW; SPH;

CHEMICAL MECHANICAL POLISHING; HYDRODYNAMICS; POLISHING;

DEBRIS;

EID: 37049036181     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.73.90     Document Type: Article

References (12)

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