In situ investigation of slurry flow fields during CMP

Journal of the Electrochemical Society

Volumn 156, Issue 12, 2009, Pages

  Mueller, N ^a   Rogers, C ^a   Manno, V P ^a   White, R ^a   Moinpour, M ^b  

^a TUFTS UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED LOADS; CHEMICAL-MECHANICAL PLANARIZATION PROCESS; FLUID FLOW FIELD; IN-SITU; MATERIAL REMOVAL PROCESS; PAD CONDITIONING; ROTATION SPEED; SLURRY FLOW; SLURRY FLUID FLOW; SLURRY INJECTION; WAFER-SCALE;

CHEMICAL MECHANICAL POLISHING; FLOW FIELDS; FLOW VISUALIZATION; LOCATION; NANOTECHNOLOGY; ROTATION;

PIPE FLOW;

EID: 70350702586     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3223562     Document Type: Article

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