Hydrodynamics of slurry flow in chemical mechanical polishing

Journal of the Electrochemical Society

Volumn 153, Issue 6, 2006, Pages

  Terrell, Elon J ^a   Higgs, C Fred ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; FLOW OF FLUIDS; HYDRODYNAMICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SILICON WAFERS;

NUMERICAL MODELS; SLURRY FLOW; WAFER SURFACE WEAR DISTRIBUTION; WAFER-PAD INTERFACE;

SLURRIES;

EID: 33646388258     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2188329     Document Type: Review

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