A contact-mechanics-based model for general rough pads in chemical mechanical polishing processes

Journal of the Electrochemical Society

Volumn 156, Issue 7, 2009, Pages

  Feng, Chunyang ^a   Yan, Changhao ^a   Tao, Jun ^a   Zeng, Xuan ^a   Cai, Wei ^a,b  

^a FUDAN UNIVERSITY   (China)

^b UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOCORRELATION FUNCTIONS; BULK DEFORMATION; CHEMICAL-MECHANICAL POLISHING PROCESS; CMP PAD; CMP PROCESS; CONJUGATE GRADIENT; CONTACT PROBLEM; DESIGN TOOL; EXPERIMENTAL DATA; HEIGHT DISTRIBUTION; MODEL PREDICTION; NON-LINEAR TRANSFORMATIONS; PAD ASPERITIES; PAD MODELS; PATTERN GEOMETRY; SPECTRAL REPRESENTATIONS; SURFACE GEOMETRIES; SURFACE HEIGHT;

CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; CORRELATION DETECTORS; EROSION; FAST FOURIER TRANSFORMS; NANOTECHNOLOGY; PHOTORESISTS; POLISHING; REGRESSION ANALYSIS;

DISTRIBUTION FUNCTIONS;

EID: 65949110350     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3133238     Document Type: Article

References (34)

1. T. E. Gbondo-Tugbawa, Ph.D. Thesis, Massachusetts Institute of Technology (2002).
2. P. B. Zantyea, A. Kumar, and A. K. Sikder, Mater. Sci. Eng. R., 45, 89 (2004). 10.1016/j.mser.2004.06.002
3. O. G. Chekina and L. M. Keer, J. Electrochem. Soc., 145, 2100 (1998). 10.1149/1.1838603
4. R. Saxena, D. G. Thakurta, R. J. Gutmann, and W. N. Gill, Thin Solid Films, 449, 192 (2004). 10.1016/j.tsf.2003.10.078
5. J.-Y. Lai, N. Saka, and J.-H. Chun, J. Electrochem. Soc., 149, G31 (2002). 10.1149/1.1420707
6. G. Fu and A. Chandra, IEEE Trans. Semicond. Manuf., 16, 477 (2003). 10.1109/TSM.2003.815202
7. J. A. Greenwood and J. B. Williamson, Proc. R. Soc. London, Ser. A, 295, 300 (1966). 10.1098/rspa.1966.0242
8. V. H. Nguyen, R. Daamen, H. van Hranenburg, P. van der Velden, and P. H. Woerlee, J. Electrochem. Soc., 150, 689 (2003). 10.1149/1.1611497
9. J. J. Vlassak, J. Mech. Phys. Solids, 52, 847 (2004). 10.1016/j.jmps.2003.07.007
10. L. Shan, C. Zhou, and S. Danyluk, IEEE Trans. Semicond. Manuf., 14, 207 (2001). 10.1109/66.939815
11. J. Luo and D. A. Dornfeld, IEEE Trans. Semicond. Manuf., 14, 112 (2001). 10.1109/66.920723
12. J. Choi, Ph.D. Thesis, University of California, Berkeley (2006).
13. J. A. Greenwood and J. J. Wu, Meccanica, 36, 617 (2001). 10.1023/A:1016340601964
14. J. F. Archard, Proc. R. Soc. London, Ser. A, A243, 190 (1957).
15. A. S. Lawing, Mater. Res. Soc. Symp. Proc., 732E, I5.3.1 (2002).
16. B. Jiang and G. P. Muldowney, Mater. Res. Soc. Symp. Proc., 991, C01 (2007).
17. J. Allwood, J. Tribol., 127, 10 (2005). 10.1115/1.1828073
18. E. J. Terrell, M. Kuo, and C. F. Higgs, Mater. Res. Soc. Symp. Proc., 991, C06 (2007).
19. E. J. Terrell and C. F. Higgs III, J. Tribol., 131, 012201 (2009).
20. Y. Zhang and S. Sundararajan, J. Appl. Phys., 97, 1 (2005). 10.1007/10828028-1
21. M. Shinozuka and G. Deodatis, Appl. Mech. Rev., 44, 191 (1991). 10.1115/1.3119501
22. M. Grigoriu, J. Eng. Mech., 124, 121 (1998). 10.1061/(ASCE)0733- 9399(1998)124:2(121)
23. I. A. Polonsky and L. M. Keer, J. Tribol., 122, 36 (2000). 10.1115/1.555326
24. S. H. Ng, Ph.D. Thesis, Georgia Institute of Technology (2005).
25. J. McGrath and C. Davis, J. Mater. Process. Technol., 153-154, 666 (2004). 10.1016/j.jmatprotec.2004.04.094
26. K. Park and H. Jeong, J. Electrochem. Soc., 155, 595 (2008). 10.1149/1.2938378
27. M. Shinozuka and G. Deodatis, Appl. Mech. Rev., 49, 29 (1996). 10.1115/1.3101883
28. K. L. Johnson, Contact Mechanics, Cambridge University Press, New York (1985).
29. I. A. Polonsky and L. M. Keer, Wear, 231, 206 (1999). 10.1016/S0043-1648(99)00113-1
30. W. W. Chen, Q. J. Wang, Y. Liu, W. Chen, J. Cao, C. Xia, R. Talwar, and R. Lederich, Tribol. Lett., 28, 27 (2007). 10.1007/s11249-007-9244-7
31. L. M. Cook, J. Non-Cryst. Solids, 120, 152 (1990). 10.1016/0022-3093(90) 90200-6
32. B. E. N. Elbel, B. Neureither, and P. Lahnor, J. Electrochem. Soc., 145, 1659 (1998). 10.1149/1.1838533
33. T. Park, T. Tugbawa, J. Yoon, D. Boning, J. Chung, R. Muralidhar, S. Hymes, Y. Gotkis, S. Alamgir, R. Walesa, VLSI Multilevel Interconnect Conference (VMIC), IMIC (1998).
34. S.-H. Chang, Microelectron. Eng., 77, 76 (2005). 10.1016/j.mee.2004.09. 003