Fundamentals of slurry design for CMP of metal and dielectric materials

MRS Bulletin

Volumn 27, Issue 10, 2002, Pages

  Singh, Rajiv K ^a   Lee, Seung Mahn ^a   Choi, Kyu Se ^a   Basim, G Bahar ^a   Choi, Wonseop ^a   Chen, Zhan ^a   Moudgil, Brij M ^a  

^a University of Florida   (United States)

Author keywords

Chemical mechanical planarization; Chemical mechanical polishing; CMP; Low dielectrics; Nanoparticles; Slurry design

Indexed keywords

ADDITIVES; COPPER; DEFECTS; DIELECTRIC MATERIALS; SLURRIES; SURFACE TOPOGRAPHY;

SLURRY DESIGN;

CHEMICAL MECHANICAL POLISHING;

EID: 0036802054     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2002.245     Document Type: Article

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