Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x = 0-35 wt%) or Cu-xZn-yNi (x = 20 and 25 wt%, y = 15 and 10 wt%) substrates

Journal of Alloys and Compounds

Volumn 575, Issue , 2013, Pages 350-358

  Kim, Young Min ^a   Kim, Tae Jin ^a   Choi, Min Young ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Cu Zn; Cu Zn Ni; Interfacial reaction; Pb free solder; Zn rich layer

Indexed keywords

INTERFACES (MATERIALS); INTERMETALLICS; LEAD; LEAD-FREE SOLDERS; NICKEL; PHASE INTERFACES; SILVER; SOLDERING; SOLDERING ALLOYS; SURFACE CHEMISTRY; TIN; ZINC;

BI-LAYER STRUCTURE; GROWTH BEHAVIOR; ISOTHERMAL AGING; MOLTEN SOLDERS; PREDOMINANT REACTIONS; SN-3.0AG-0.5CU; SN-3.0AG-0.5CU SOLDERS; SOLDER INTERFACES;

COPPER COMPOUNDS;

EID: 84879495468     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.05.167     Document Type: Article

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