메뉴 건너뛰기
Journal of Electronic Materials
Volumn 39, Issue 12, 2010, Pages 2636-2642
Effects of Ni additions on the growth of Cu 3Sn in high-lead solders
Author keywords

high lead; microvoids; Solder; soldering
Indexed keywords

EXPERIMENTAL OBSERVATION; HIGH-LEAD; LEAD SOLDERS; MICRO VOIDS; NI ADDITIONS; REACTION CONDITIONS; SOLDER; SOLID-STATE AGING;
EID: 78049528182     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1317-y     Document Type: Conference Paper
Times cited : (8)
References (21)
  • 1
    • 11344295794 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD2MXhsVKi 10.1007/s11664-004-0090-1 2004JEMat.33.1485A
    • IE Anderson JL Harringa 2004 J. Electron. Mater. 33 1485 1:CAS:528:DC%2BD2MXhsVKi 10.1007/s11664-004-0090-1 2004JEMat..33.1485A
    • (2004) J. Electron. Mater. , vol.33 , pp. 1485
    • Anderson, I.E.1    Harringa, J.L.2
  • 2
    • 33745029082 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD28XlsVOisL0%3D 10.1007/BF02692546 2006JEMat.35.905G
    • F Gao T Takemoto H Nishikawa A Komatsu 2006 J. Electron. Mater. 35 905 1:CAS:528:DC%2BD28XlsVOisL0%3D 10.1007/BF02692546 2006JEMat..35..905G
    • (2006) J. Electron. Mater. , vol.35 , pp. 905
    • Gao, F.1    Takemoto, T.2    Nishikawa, H.3    Komatsu, A.4
  • 3
    • 0348107255 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD3sXpslSmtrk%3D 10.1007/s11664-003-0012-7 2003JEMat.32.1203T
    • JY Tsai YC Hu CM Tsai CR Kao 2003 J. Electron. Mater. 32 1203 1:CAS:528:DC%2BD3sXpslSmtrk%3D 10.1007/s11664-003-0012-7 2003JEMat..32.1203T
    • (2003) J. Electron. Mater. , vol.32 , pp. 1203
    • Tsai, J.Y.1    Hu, Y.C.2    Tsai, C.M.3    Kao, C.R.4
  • 4
    • 67349083563 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXls1Gru7s%3D 10.1016/j.jallcom.2008.11.052
    • YW Wang YW Lin CT Tu CR Kao 2009 J. Alloy Compd. 478 121 1:CAS:528:DC%2BD1MXls1Gru7s%3D 10.1016/j.jallcom.2008.11.052
    • (2009) J. Alloy Compd. , vol.478 , pp. 121
    • Wang, Y.W.1    Lin, Y.W.2    Tu, C.T.3    Kao, C.R.4
  • 5
    • 67349152353 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXls1KjtLk%3D 10.1016/j.jallcom.2008.11.027
    • YW Wang CC Chang CR Kao 2009 J. Alloy Compd. 478 L1 1:CAS:528: DC%2BD1MXls1KjtLk%3D 10.1016/j.jallcom.2008.11.027
    • (2009) J. Alloy Compd. , vol.478 , pp. 1
    • Wang, Y.W.1    Chang, C.C.2    Kao, C.R.3
  • 6
    • 60849105954 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXisFertLo%3D 10.1016/j.microrel.2008.09.010
    • YW Wang YW Lin CR Kao 2009 Microelectron. Reliab. 49 248 1:CAS:528:DC%2BD1MXisFertLo%3D 10.1016/j.microrel.2008.09.010
    • (2009) Microelectron. Reliab. , vol.49 , pp. 248
    • Wang, Y.W.1    Lin, Y.W.2    Kao, C.R.3
  • 7
    • 0942277781 scopus 로고    scopus 로고
    • 10.1007/s11664-003-0111-5 2003JEMat.32.1426C
    • CM Chung KL Lin 2003 J. Electron. Mater. 32 1426 10.1007/s11664-003-0111- 5 2003JEMat..32.1426C
    • (2003) J. Electron. Mater. , vol.32 , pp. 1426
    • Chung, C.M.1    Lin, K.L.2
  • 8
    • 33745056527 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD28XlsVOit70%3D 10.1007/BF02692576 2006JEMat.35.1127N
    • H Nishikawa JY Piao T Takemoto 2006 J. Electron. Mater. 35 1127 1:CAS:528:DC%2BD28XlsVOit70%3D 10.1007/BF02692576 2006JEMat..35.1127N
    • (2006) J. Electron. Mater. , vol.35 , pp. 1127
    • Nishikawa, H.1    Piao, J.Y.2    Takemoto, T.3
  • 9
    • 32644434009 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD28Xht1Omtbc%3D 10.1007/s11664-006-0190-1 2006JEMat.35.94A
    • IE Anderson JL Harringa 2006 J. Electron. Mater. 35 94 1:CAS:528:DC%2BD28Xht1Omtbc%3D 10.1007/s11664-006-0190-1 2006JEMat..35...94A
    • (2006) J. Electron. Mater. , vol.35 , pp. 94
    • Anderson, I.E.1    Harringa, J.L.2
  • 11
    • 33749863019 scopus 로고    scopus 로고
    • Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
    • DOI 10.1557/jmr.2006.0320
    • SC Yang CE Ho CW Chang CR Kao 2006 J. Mater. Res. 21 2436 1:CAS:528:DC%2BD28XhtVyls7nN 10.1557/jmr.2006.0320 2006JMatR..21.2436Y (Pubitemid 44560182)
    • (2006) Journal of Materials Research , vol.21 , Issue.10 , pp. 2436-2439
    • Yang, S.C.1    Ho, C.E.2    Chang, C.W.3    Kao, C.R.4
  • 13
    • 35248860213 scopus 로고    scopus 로고
    • Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
    • DOI 10.1007/s11664-007-0254-x
    • MG Cho SK Kang DY Shih HM Lee 2007 J. Electron. Mater. 36 1501 1:CAS:528:DC%2BD2sXht1Cku7vM 10.1007/s11664-007-0254-x 2007JEMat..36.1501C (Pubitemid 47561764)
    • (2007) Journal of Electronic Materials , vol.36 , Issue.11 , pp. 1501-1509
    • Cho, M.G.1    Kang, S.K.2    Shih, D.-Y.3    Lee, H.M.4
  • 14
    • 34547106589 scopus 로고    scopus 로고
    • Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
    • DOI 10.1557/jmr.2007.0234
    • YK Jee YH Ko J Yu 2007 J. Mater. Res. 22 1879 1:CAS:528: DC%2BD2sXnvVajtrY%3D 10.1557/jmr.2007.0234 2007JMatR..22.1879J (Pubitemid 47098570)
    • (2007) Journal of Materials Research , vol.22 , Issue.7 , pp. 1879-1887
    • Jee, Y.K.1    Ko, Y.H.2    Yu, J.3
  • 19
    • 0035797072 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD3MXkt1KmtL4%3D
    • KN Tu K Zeng 2001 Mater. Sci. Eng. R34 1 1:CAS:528:DC%2BD3MXkt1KmtL4%3D
    • (2001) Mater. Sci. Eng. , vol.34 , pp. 1
    • Tu, K.N.1    Zeng, K.2
  • 20
    • 0035484214 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD3MXns1Wlt7c%3D 10.1007/s11664-001-0118-8 2001JEMat.30.1317A
    • S Ahat M Sheng L Luo 2001 J. Electron. Mater. 30 1317 1:CAS:528:DC%2BD3MXns1Wlt7c%3D 10.1007/s11664-001-0118-8 2001JEMat..30.1317A
    • (2001) J. Electron. Mater. , vol.30 , pp. 1317
    • Ahat, S.1    Sheng, M.2    Luo, L.3
  • 21
    • 19944432174 scopus 로고    scopus 로고
    • Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
    • DOI 10.1063/1.1839637, 024508
    • K Zeng R Stierman TC Chiu D Edwards K Ano KN Tu 2005 J. Appl. Phys. 97 024508 10.1063/1.1839637 2005JAP....97b4508Z (Pubitemid 40183072)
    • (2005) Journal of Applied Physics , vol.97 , Issue.2 , pp. 0245081-0245088
    • Zeng, K.1    Stierman, R.2    Chiu, T.-C.3    Edwards, D.4    Ano, K.5    Tu, K.N.6

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.