Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 84-89

  Seo, Sun Kyoung ^a   Cho, Moon Gi ^a   Kang, Sung K ^b   Chang, Jaewon ^c   Lee, Hyuck Mo ^a  

^a SAMSUNG Electronics   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENEFICIAL EFFECTS; BULK PROPERTIES; COMPOSITION RANGES; COOLING RATES; DIAGRAM ANALYSIS; JOINT RELIABILITY; MECHANICAL RELIABILITY; MINOR ALLOYING; PB FREE SOLDERS; SOLDER JOINT RELIABILITY; SOLDER JOINTS;

ALLOYING; ALLOYING ELEMENTS; COOLING; LEAD; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; PHASE DIAGRAMS; RELIABILITY; SOLDERING ALLOYS; SOLIDIFICATION; TIN; UNDERCOOLING;

ZINC;

EID: 79960387165     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898496     Document Type: Conference Paper

References (13)

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