Mechanism of the delayed growth of intermetallic compound at the interface between Sn-4.0Ag-0.5Cu and Cu-Zn substrate

Electronic Materials Letters

Volumn 6, Issue 4, 2010, Pages 151-154

  Kim, Young Min ^a   Harr, Kyoung Moo ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Cu Zn wetting layer; Diffusion barrier; Intermetallic compound; Pb free solder

Indexed keywords

AGING TIME; CU LAYERS; DRIVING FORCES; GROWTH OF INTERMETALLICS; INTER-DIFFUSION; INTERMETALLIC COMPOUND; MICRO-VOID FORMATION; PB FREE SOLDERS; SAC-SOLDERS; SN-AG-CU; SOLDER INTERFACES; WETTING LAYER; ZN ATOMS;

COPPER COMPOUNDS; DIFFUSION BARRIERS; INTERMETALLICS; LEAD; LEAD COMPOUNDS; SOLDERING ALLOYS; WETTING; ZINC;

TIN;

EID: 78650989804     PISSN: 17388090     EISSN: None     Source Type: Journal    
DOI: 10.3365/eml.2010.12.151     Document Type: Article

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