Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

Journal of Materials Research

Volumn 22, Issue 7, 2007, Pages 1879-1887

  Jee, Young Kun ^a   Ko, Y H ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DROP RESISTANCE; ISOTHERMAL AGING;

AGE HARDENING; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; ZINC;

SOLDERING ALLOYS;

EID: 34547106589     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0234     Document Type: Article

References (34)

1. J. Muller, H. Griese, K.H. Zuber, H. Reichl, and K. Schischke: Environmental aspects of microelectronics. Adv. Electron. Packag. 3, 1575 (2001).
2. M. Li, F. Zhang, W.T. Chen, K. Zeng, K.N. Tu, H. Balkan, and P. Elenius: Intefacial microstructure evolution between eutectic SnAgCu solder and AI/Ni(V)/Cu thin films. J. Mater. Res. 17, 1612 (2002).
3. S.K. Kang, R.S. Rai, and S. Purushothaman: Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solder. J. Electron. Mater. 25, 1113 (1996).
4. C.Y. Chou and S.W. Chen: Phase equlibria of the Sn-Zn-Cu ternary system. Acta Mater. 5, 2393 (2006).
5. M. McCormack, G.W. Kammlott, H.S. Chen, and S. Jin: New lead-free, Sn-Ag-Zn-Cu solder alloy with improved mechanical properties. Appl. Phys. Lett. 65, 1233 (1994).
6. C.M.L. Wu and C.M.T. Law: Microstructure evolution and shear strength of eutectic Sn-9Zn and Sn-0.7Cu lead-free BGA solder balls. Proc. HDP 04, 47 (2004).
7. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M.E. Fine: Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders. J. Electron. Mater. 41, 1269 (1997).
8. 3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying. J. Metals 56, 34 (2004).
9. K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda: Heat resistance of Sn-9Zn solder/Cu interface with or without coating. J. Mater. Res. 15, 884 (2000).
10. H. Yanagawa, T. Imamura, E. Ide, A. Hirose, and K. Kobayashi: Investigation of the interfacial reaction between Sn-Zn-Bi lead-free solder and Cu electrode. J. Jpn. Inst. Electron. Packag. 7, 47 (2004).
11. Y. Chonan, T. Komiyama, J. Onuki, R. Urao, T. Kimura, and T. Nagano: Influence of P content in electroless plated Ni-P alloy film on interfacial structures and strength between Sn-Zn solder and plated Au/ Ni-P alloy film. Mater. Trans. 43, 1887 (2002).
12. T.C. Chang, M.C. Wang, and M.S. Hon: Growth and morphology of the intermetallic compounds formed at the Sn-9Zn-2.5Ag/Cu interface. J. Alloys Compd. 402, 141 (2005).
13. S.C. Yang, C.E. Ho, C.W. Chang, and C.R. Kao: Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu. J. Mater. Res. 21, 2436 (2006).
14. JESD22-B111, Board Level Drop Test Method of Components for Handheld Electronic Components (JEDEC Solid State Technology Association, 2003).
15. W.T. Chen, R.Y. Tsai, Y.L. Lin, and C.R. Kao: Effect of concentration on the reactions between Sn-Ag-Cu solders and Ni. J. Electron. Mater. 31, 584 (2002).
16. M.O. Alam, Y.C. Chen, and K.N. Tu: Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad. J. Appl. Phys. 94, 4108 (2003).
17. Y.C. Sohn, Yu. Jin, S.K. Kang, D.Y. Shih, and T.Y. Lee: Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization. J. Mater. Res. 19(8), 2428 (2004).
18. Y.C. Sohn and J. Yu: Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection. J. Mater. Res. 20, 1931 (2005).
19. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao: Effect of Cu concentration on the reactions between Sn-Ag-Cu solder and Ni. J. Electron. Mater. 31, 392 (2002).
20. T.C. Chiu, K. Zeng, R. Strierman, D. Edwards, and K. Ano: Effect of thermal aging on board level drop reliability for Pb-free BGA packages, in Proc. 54th Electronic Component and Technology Conference, (2004), p. 1256.
21. J. Yu, Y.C. Sohn, J.Y. Kim, Y.K. Jee, and Y.H. Ko: Impact reliabilities of lead-free solder joints with Ni(P), Cu and Ni metallizations, in Proc. International Conference on Electronics Packaging, (2006), p. 271.
22. W.K. Choi: Interfacial phenomena and characterization of Sn-Ag-based solder alloy systems for electronic packaging. Ph.D. thesis, Korea Advanced Institute of Science and Technology (2001).
23. S.W. Jeong, J.H. Kim, and H.M. Lee: Effect of cooling rate on growth of the intermetallic compound and fracture mode of near eutectic Sn-Ag-Cu/ Cu pad: Before and after aging. J. Electron. Mater. 33, 1530 (2004).
24. Z. Mei, M. Ahmad, M. Hu, and G. Ramakrishna: Kirkendall voids at Cu/ solder interface and their effects on solder joint reliability, in Proc 55th Electronic Component and Technology Conference, (2005), p. 415.
25. K. Zeng, R. Stierman, T.C. Chiu, and D. Edwards: Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005).
26. S.K. Kang, D. Leonard, D.Y. Shih, L. Gignac, D.W. Henderson, S.I. Cho, and J. Yu: Interfacial reactions of Sn-Ag-Cu solder modified by minor Zn alloying addition. J. Electron. Mater. 35, 479 (2006).
27. C.H. Yu and K.L. Lin: Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate. J. Mater. Res. 20, 1242 (2005).
28. J.M. Song, P.C. Liu, C.L. Shih, and K.L. Lin: Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering. J. Electron. Mater. 34, 1249 (2005).
29. M. Date, K.N. Tu, T. Shoji, M. Fujiyoshi, and K. Sato: Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads. J. Mater. Res. 19, 2887 (2004).
30. S.P. Yu, M.C. Wang, and M.H. Hon: Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface. J. Mater. Res. 16, 76 (2001).
31. J.W. Jang, D. Silva A, J.K. Lin, and D. Frear: Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps, in Proc 53th Electronic Component and Technology Conference, (2003), p. 680.
32. D.Y.R. Chong, F.X. Che, L.H. Xu, H.J. Toh, J.H.L. Pang, B.S. Xiong, and B.K. Lim: Performance assessment on board-level drop reliability for chip scale packages (Fine-pitch BGA), in Proc 56th Electronic Component and Technology Conference, (2006), p. 356.
33. J.Y. Kim, Y.C. Sohn, and J. Yu: Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system. J. Mater. Res. 22, 770 (2007).
34. S.K. Kang, P.A. Lauro, D.Y. Shih, D.W. Henderson, and K.J. Puttlitz: Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. IBM J. Res. & Dev. 49(4), 607 (2005).