Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates

ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2012, Pages 426-429

  Hwang, Ji Hwan ^a   Kim, Young Min ^a   Kim, Tae Jin ^a   Kim, Young Ho ^a   Lee, Won Jong ^b  

^a Hanyang University   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

IMC THICKNESS; INITIAL STAGES; INTER-METALLIC COMPOUNDS; ISOTHERMAL AGING; NI SUBSTRATES; SIGNIFICANT DIFFERENCES; SN-3.0AG-0.5CU SOLDERS; WETTING LAYER;

CHIP SCALE PACKAGES; INTERFACES (MATERIALS); INTERMETALLICS; NICKEL; SOLDERING ALLOYS; SUBSTRATES; TESTING; THERMAL AGING; TIN; ZINC;

COPPER COMPOUNDS;

EID: 84875471535     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT-HDP.2012.6474650     Document Type: Conference Paper

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