A New Cu-Zn Solder Wetting Layer for Improved Impact Reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1008-1013

  Kim, Young Min ^a   Oh, Chang Yul ^a   Roh, Hee Ra ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; CU LAYERS; CU SUBSTRATE; CU-ZN ALLOY; DOUBLE LAYERS; DROP IMPACT; DROP TEST; GROWTH OF INTERMETALLICS; MICRO VOIDS; PB FREE SOLDERS; SAC-SOLDERS; SHEAR TESTS; SN-AG-CU; SOLDER BALLS; SOLDER BUMP; SOLDER JOINTS; SOLDER WETTING; VOLUME DIFFUSION; WETTING LAYER;

DUCTILE FRACTURE; GROWTH KINETICS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; WETTING; ZINC;

TIN;

EID: 70349653030     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074135     Document Type: Conference Paper

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