Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies

Journal of Alloys and Compounds

Volumn 474, Issue 1-2, 2009, Pages 510-516

  Cho, Moon Gi ^a   Seo, Sun Kyoung ^a   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Intermetallics; Liquid solid reactions; Metals and alloys; Solid state reactions

Indexed keywords

ALLOYS; BRAZING; COPPER ALLOYS; LEAD; LIQUIDS; METALLURGY; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SOLID STATE REACTIONS; TIN ALLOYS; WELDING; ZINC;

INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LIQUID-SOLID REACTIONS; METALS AND ALLOYS; PB-FREE SOLDERS; SN-3.8AG-0.7CU SOLDERS; SOLDER JOINTS; UNDER-BUMP METALLURGIES; WEIGHT PERCENTS; ZN CONTENTS;

TIN;

EID: 61649119014     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.06.141     Document Type: Article

References (20)

1. Choi W.K., Kim J.H., Jeong S.W., and Lee H.M. J. Mater. Res. 17 1 (2002) 43-51
2. Bath J., Handwerker C., and Bradley E. Circ. Assemb. 11 (2000) 31-40
3. Kang S.K., Choi W.K., Yim M.J., and Shih D.Y. J. Electron. Mater. 31 11 (2002) 1292-1303
4. Puttlitz K.J. In: Puttlitz K.J., and Stalter K.A. (Eds). Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (2004), Marcel Dekker, Inc., New York pp. 239-280
5. Kang S.K., Lauro P., Shih D.Y., Henderson D.W., and Puttlitz K.J. IBM J. Res. Dev. 49 4/5 (2005) 607-620
6. Lee K.Y., Li M., Olsen D.R., Chen W.T., Tan B.T.C., and Mhaisalkar S. Proceedings of 51st Electronic Components and Technology Conference. Orlando, Florida (2004), IEEE, Piscataway, New Jersey 478-485
7. Anderson I.E., and Harringa J.L. J. Electron. Mater. 33 12 (2004) 1485-1496
8. Chiu T.C., Zeng K., Stierman R., Edwards D., and Ano K. Proceedings of 54th Electronic Components and Technology Conference. Las Vegas, Nevada (2004), IEEE, Piscataway, New Jersey 1256-1262
9. Xu L., and Pang J.H.L. Proceedings of 56th Electronic Components and Technology Conference. San Diego, California (2006), IEEE, Piscataway, New Jersey 275-282
10. Kim K.S., Huh S.H., and Suganuma K. Microelectron. Reliab. 43 (2002) 259-267
11. Kang S.K., Shih D.-Y., Leonard D., Henderson D.W., Gosselin T., Cho S.-I., Yu J., and Choi W.K. JOM 56 6 (2004) 34-38
12. Kang S.K., Leonard D., Shih D.-Y., Gignac L., Henderson D.W., Cho S.-I., and Yu J. J. Electron. Mater. 35 3 (2006) 479-485
13. de Sousa I., Henderson D.W., Patry L., Kang S.K., and Shih D.-Y. Proceedings of 56th Electronic Components and Technology Conference. San Diego, California (2006), IEEE, Piscataway, New Jersey 1454-1462
14. Cho M.G., Kang S.K., Shih D.-Y., and Lee H.M. J. Electron. Mater. 36 11 (2007) 1501-1509
15. Okamoto H. Desk Handbook: Phase Diagrams for Binary Alloys (2000), ASM International, Materials Park, OH pp. 314-315
16. Sundman B., Jansson B., and Andersson J.O. CALPHAD 9 (1985) 153-190
17. Lee B.-J., Hwang N.-M., and Lee H.M. Acta Mater. 45 5 (1997) 1867-1874
18. Jantzen T., and Spencer P.J. CALPHAD 22 (1998) 417-434
19. Lee H.M., Yoon S.W., and Lee B.-J. J. Electron. Mater. 27 11 (1998) 1161-1166
20. Yoon S.W., Choi W.K., and Lee H.M. Scripta Mater. 40 3 (1999) 327-332