Electronic structure mechanism for the wettability of Sn-based solder alloys

Journal of Electronic Materials

Volumn 31, Issue 3, 2002, Pages 185-190

  Feng, Wufeng ^a   Wang, Chunqing ^b   Morinaga, M ^c  

^a Shanghai Post Telecom Devmt Gen Co   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c Department of Materials Science and Engineering   (Japan)

Author keywords

Electronic mounting; Orbital interaction; Packaging; Quantum theory; Relativistic DV X calculation; Sn based solder; Wettability

Indexed keywords

APPROXIMATION THEORY; ATOMS; COMPUTATIONAL METHODS; ELECTRONIC STRUCTURE; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; QUANTUM THEORY; RELATIVITY; SOLID STATE PHYSICS; SUBSTRATES; TIN ALLOYS; WETTING;

ELECTRONIC MOUNTING; HARTREE-FOCK-DIRAC APPROXIMATION; MULLIKEN ANALYSIS; ORBITAL INTERACTION; RELATIVISTIC EFFECTS; WETTABILITY;

SOLDERING ALLOYS;

EID: 0036502993     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0204-6     Document Type: Article

References (8)