A new solder wetting layer for Pb-free solders

Journal of Materials Research

Volumn 24, Issue 2, 2009, Pages 297-300

  Oh, Chang Yul ^a   Roh, Hee Ra ^a   Kim, Young Min ^a   Lee, Jin Soo ^a   Cho, Hae Young ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; INTERMETALLICS; LEAD; LEAD ALLOYS; SILVER; SOLDERING ALLOYS; WELDING; WETTING; ZINC;

INTERMETALLIC COMPOUNDS; INTERMETALLIC GROWTHS; MICRO-VOIDS; PB-FREE SOLDERS; SN-AG-CU; SOLDER INTERFACES; SOLDER WETTING; WETTING LAYERS;

TIN;

EID: 61749087132     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2009.0047     Document Type: Article

References (20)

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