The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

Scripta Materialia

Volumn 65, Issue 4, 2011, Pages 331-334

  Chen, W M ^a   Yang, T L ^a   Chung, C K ^a   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compounds; Orientation issues; Soldering reaction; Textured morphology

Indexed keywords

ELECTRON BACK SCATTER DIFFRACTION; ORIENTATION RELATIONSHIP; PREFERRED ORIENTATIONS; RANDOM ORIENTATIONS; SOLDERING REACTION; SOLDERING REACTIONS; TEXTURED MORPHOLOGY; THREE DIMENSIONAL INTEGRATED CIRCUITS;

HIGH RESOLUTION ELECTRON MICROSCOPY; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INTERMETALLICS; SOLDERING; TRANSMISSION ELECTRON MICROSCOPY;

TIN;

EID: 79958191484     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.04.034     Document Type: Article

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