Thermal stability of sputtered Cu films with nanoscale growth twins

Journal of Applied Physics

Volumn 103, Issue 9, 2008, Pages

  Anderoglu, O ^a   Misra, A ^b   Wang, H ^c   Zhang, X ^a  

^a Texas AandM University   (United States)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

^c TEXAS A AND M UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER COMPOUNDS; FILM GROWTH; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HARDNESS; SPUTTERING; THERMODYNAMIC STABILITY;

HIGH VACUUM ANNEALING; MONOLITHIC NANOCRYSTALS; NANOTWINNED STRUCTURES;

THIN FILMS;

EID: 43949085395     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2913322     Document Type: Article

References (46)

1. act J. Schiotz and K. W. Jacobsen, Science 0036-8075 10.1126/science. 1086636 301, 1357 (2003).
2. G. W. Nieman, J. R. Weertman, and R. W. Siegel, J. Mater. Res. 0884-2914 10.1557/JMR.1991.1012 6, 1012 (1991).
3. J. Chen, L. Lu, and K. Lu, Scr. Mater. 1359-6462 10.1016/j.scriptamat. 2006.02.022 54, 1913 (2006).
4. L. Lu, L. B. Wang, B. Z. Ding, and K. Lu, Mater. Sci. Eng., A 286, 125 (2000). 0025-5416
5. P. G. Sanders, J. A. Eastman, and J. R. Weertman, Acta Mater. 45, 4019 (1997).
6. J. R. Weertman, D. Farkas, K. Hemker, H. Kung, M. Mayo, R. Mitra, and H. Van Swygenhoven, MRS Bull. 24, 44 (1999). 0883-7694
7. X. Zhang, A. Misra, H. Wang, T. D. Shen, J. G. Swadener, J. D. Embury, H. Kung, R. G. Hoagland, and M. Nastasi, J. Mater. Res. 0884-2914 10.1557/JMR.2003.0220 18, 1600 (2003).
8. A. Misra, M. Verdier, Y. C. Lu, H. Kung, T. E. Mitchell, M. Nastasi, and J. D. Embury, Scr. Mater. 1359-6462 10.1016/S1359-6462(98)00196-1 39, 555 (1998).
9. B. M. Clemens, H. Kung, and S. A. Barnett, MRS Bull. 24, 20 (1999). 0883-7694
10. A. Misra, J. P. Hirth, and R. G. Hoagland, Acta Mater. 53, 4817 (2005).
11. X. Zhang, H. Wang, X. H. Chen, L. Lu, K. Lu, R. G. Hoagland, and A. Misra, Appl. Phys. Lett. 0003-6951 10.1063/1.2198482 88, 173116 (2006).
12. L. Lu, Y. Shen, X. Chen, L. Qian, and K. Lu, Science 0036-8075 10.1126/science.1092905 304, 422 (2004).
13. Y. F. Shen, L. Lu, Q. H. Lu, Z. H. Jin, and K. Lu, Scr. Mater. 1359-6462 10.1016/j.scriptamat.2005.01.033 52, 989 (2005).
14. W. J. Babyak and F. N. Rhines, Trans. Am. Inst. Min., Metall. Pet. Eng. 218, 21 (1960).
15. X. Zhang, A. Misra, H. Wang, A. L. Lima, M. F. Hundley, and R. G. Hoagland, J. Appl. Phys. 0021-8979 10.1063/1.1883724 97, 094302 (2005).
16. X. Zhang, A. Misra, H. Wang, M. Nastasi, J. D. Embury, T. E. Mitchell, R. G. Hoagland, and J. P. Hirth, Appl. Phys. Lett. 0003-6951 10.1063/1.1647690 84, 1096 (2004).
17. J. W. Christian and S. Mahajan, Prog. Mater. Sci. 0079-6425 10.1016/0079-6425(94)00007-7 39, 1 (1995).
18. X. Zhang, A. Misra, H. Wang, T. D. Shen, M. Nastasi, T. E. Mitchell, J. P. Hirth, R. G. Hoagland, and J. D. Embury, Acta Mater. 52, 995 (2004).
19. X. Zhang, O. Anderoglu, A. Misra, and H. Wang, Appl. Phys. Lett. 0003-6951 10.1063/1.2720708 90, 153101 (2007).
20. V. Y. Gertsman and R. Birringer, Scr. Metall. Mater. 30, 577 (1994).
21. M. Kobiyama, T. Inami, and S. Okuda, Scr. Mater. 1359-6462 10.1016/S1359-6462(01)00834-X 44, 1547 (2001).
22. C. F. Gu, F. Dalla Torre, J. Sandlin, E. V. Pereloma, and C. H. J. Davies, Mater. Forum 29, 551 (2005).
23. K. Oh-Ishi, Z. Horita, D. J. Smith, R. Z. Valiev, M. Nemoto, and T. G. Langdon, J. Mater. Res. 14, 4200 (1999). 0884-2914
24. R. K. Islamgaliev, F. Chmelik, and R. Kuzel. Mater. Sci. Eng., A 234-236, 335 (1997).
25. S. Okuda, M. Kobiyama, T. Inami, and S. Takamura, Scr. Mater. 44, 2009 (2001).
26. X. Zhang, A. Misra, H. Wang, A. L. Lima, M. F. Hundley, and R. G. Hoagland, Appl. Phys. Lett. 0003-6951 10.1063/1.2135871 87, 233116 (2005).
27. N. Hansen and B. Ralph, Acta Metall. 0001-6160 10.1016/0001-6160(82) 90221-8 30, 411 (1982).
28. H. Jiang, T. Zhu, D. P. Butt, I. V. Alexsandrov, and T. C. Lowe, Mater. Sci. Eng., A 0921-5093 10.1016/S0921-5093(00)00919-9 290, 128 (2000).
29. I. M. Ghauri, M. Z. Butt, and S. M. Raza, Int. J. Math. Math. Sci. 25, 4782 (1990).
30. L. Lu, N. R. Tao, L. B. Wang, B. Z. Ding, and K. Lu, J. Appl. Phys. 0021-8979 10.1063/1.1367401 89, 6408 (2001).
31. S. K. Ganapathi, D. M. Owen, and A. H. Chokshi, Scr. Metall. Mater. 25, 2699 (1991).
32. H. V. Atkinson, Acta Metall. Sin. 36, 469 (1988). 0001-6160
33. C. V. Thomson, Annu. Rev. Mater. Sci. 0084-6600 10.1146/annurev.matsci. 20.1.245 20, 245 (1990).
34. K. Barmak, A. Gungor, A. D. Rollett, C. Cabral, Jr., and J. M. E. Harper, Mater. Sci. Semicond. Process. 1369-8001 10.1016/S1369-8001(03)00062-3 6, 175 (2003).
35. L. A. Zepeda-Ruiz, G. H. Gilmer, B. Sadigh, A. Caro, T. Oppelstrup, and A. V. Hamza, Appl. Phys. Lett. 0003-6951 10.1063/1.2137871 87, 231904 (2005).
36. R. W. Cahn and P. Haasen, Physical Metallurgy (North-Holland, New York, 1996), p. 2476.
37. Y. K. Huang, A. A. Menovsky, and F. R. de Boer, Nanostruct. Mater. 2, 587 (1993).
38. L. E. Murr, Interfacial Phenomena in Metals and Alloys Reading (Addison-Wesley, Reading, MA, 1975), p. 76.
39. J. P. Hirth and J. Lothe, Theory of Dislocations, 2nd ed. (Krieger, Melbourne, 1992).
40. J. Schiotz, F. D. Di Tolla, and K. W. Jacobsen, Nature (London) 0028-0836 10.1038/35328 391, 561 (1998).
41. T. G. Nieh and J. Wadsworth, Scr. Metall. Mater. 0956-716X 10.1016/0956-716X(91)90256-Z 25, 955 (1991).
42. S. I. Rao and P. M. Hazzledine, Philos. Mag. A 0141-8610 10.1080/01418610050132675 80, 2011 (2000).
43. A. Misra, J. P. Hirth, and H. Kung, Philos. Mag. A 0141-8610 10.1080/0141861021000014849 82, 2935 (2002).
44. R. G. Hoagland, T. E. Mitchell, J. P. Hirth, and H. Kung, Philos. Mag. A 0141-8610 10.1080/01418610110079399 82, 643 (2002).
45. J. Wang and H. Huang, Appl. Phys. Lett. 0003-6951 10.1063/1.2204760 88, 203112 (2006).
46. T. Zhu, J. Li, A. Samanta, H. G. Kim, and S. Suresh, Proc. Natl. Acad. Sci. U.S.A. 0027-8424 10.1073/pnas.0611097104 104, 3031 (2007).