Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper

Science

Volumn 336, Issue 6084, 2012, Pages 1007-1010

  Hsiao, Hsiang Yao ^a   Liu, Chien Min ^a   Lin, Han Wen ^a   Liu, Tao Chi ^a   Lu, Chia Ling ^a   Huang, Yi Sa ^a   Chen, Chih ^a   Tu, K N ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLYTE; LEAD; NANOPARTICLE; NANOTWINNED COPPER; SILICON; SURFACTANT; UNCLASSIFIED DRUG;

COPPER; INTEGRATED APPROACH; LEAD; MICROSTRUCTURE; THREE-DIMENSIONAL MODELING;

ARTICLE; CHEMICAL REACTION; CHEMICAL STRUCTURE; CRYSTAL STRUCTURE; DENSITY; ELECTROPLATING INDUSTRY; GROWTH; MICROBUMP; MICROTECHNOLOGY; PRIORITY JOURNAL; TRANSMISSION ELECTRON MICROSCOPY;

EID: 84861438447     PISSN: 00368075     EISSN: 10959203     Source Type: Journal    
DOI: 10.1126/science.1216511     Document Type: Article

References (22)

1. J. C. Lin et al., paper presented at IEEE International Electron Devices Meeting, San Francisco, CA, 6 December 2010.
2. M. Lu, D. Y. Shih, P. Lauro, C. Goldsmith, D. W. Henderson, Appl. Phys. Lett. 92, 211909 (2008).
3. C. Chen, H. M. Tong, K. N. Tu, Annu. Rev. Mater. Res. 40, 531 (2010).
4. D. R. Flack, Fundamentals of Jet Propulsion with Applications (Cambridge Univ. Press, New York, 2005), chap. 8.
5. L. Lu, Y. Shen, X. Chen, L. Qian, K. Lu, Science 304, 422 (2004); 10.1126/science.1092905.
6. L. Lu, X. Chen, X. Huang, K. Lu, Science 323, 607 (2009).
7. X. Li, Y. Wei, L. Lu, K. Lu, H. Gao, Nature 464, 877 (2010).
8. J. Schiøtz, K. W. Jacobsen, Science 301, 1357 (2003).
9. S. J. Zhou, D. L. Preston, P. S. Lomdahl, D. M. Beazley, Science 279, 1525 (1998).
10. L. Lu, M. L. Sui, K. Lu, Science 287, 1463 (2000).
11. K. Lu, L. Lu, S. Suresh, Science 324, 349 (2009).
12. K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen, K. N. Tu, Science 321, 1066 (2008).
13. O. Anderoglu et al., Appl. Phys. Lett. 93, 083108 (2008).
14. See supplementary materials on Science Online.
15. J. O. Suh, K. N. Tu, N. Tamura, J. Appl. Phys. 102, 063511 (2007).
16. H. F. Zou, H. J. Yang, Z. F. Zhang, Acta Mater. 56, 2649 (2008).
17. H. F. Zou, H. J. Yang, Z. F. Zhang, J. Appl. Phys. 106, 113512 (2009).
18. Y. Yin et al., Science 304, 711 (2004).
19. K. Zeng et al., J. Appl. Phys. 97, 024508 (2005).
20. R. Labie et al., paper presented at the 3rd Electronic System-Integration Technology Conference (IEEE Components, Packaging, and Manufacturing Technology Society), Berlin, Germany, 13 September 2010.
21. L. Xu et al., J. Appl. Phys. 104, 113717 (2008).
22. A. Yeoh et al., paper presented at Electronic Components and Technology Conference (IEEE), San Diego, CA, 30 May 2006.