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Volumn 66, Issue 10, 2012, Pages 741-744

The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

Author keywords

Copper; Diffusion; Intermetallic compounds; Nickel; Soldering

Indexed keywords

CONCENTRATION GRADIENTS; LIQUID STATE; MICRO-BUMPS;

COPPER; DIFFUSION; INTERMETALLICS; NICKEL; SOLDERING ALLOYS;

SOLDERING;

EID: 84862803844 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2012.01.046 Document Type: Article

Times cited : (48)

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