Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition

Applied Physics Letters

Volumn 91, Issue 25, 2007, Pages

  Xu, Di ^a   Kwan, Wei Lek ^a   Chen, Kai ^a   Zhang, Xi ^a   Ozolinš, Vidvuds ^a   Tu, K N ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINDING ENERGY; COPPER; ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; STRAIN RELAXATION; STRESS RELAXATION;

BIAXIAL STRESS; NANOTWINNED COPPER; PULSE ELECTRODEPOSITION;

THIN FILMS;

EID: 37549002454     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2825412     Document Type: Article

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