Advanced reliability modeling of Cu/low-k interconnection in FCBGA package

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 964-971

  Fiori, Vincent ^a   Zhang, Xueren ^b   Tee, Tong Yan ^b  

^a STMICROELECTRONICS   (France)

^b STMICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COMPUTER SIMULATION; CRACK PROPAGATION; DELAMINATION; INTERCONNECTION NETWORKS; RELIABILITY THEORY; SUBSTRATES;

CONSECUTIVE MATERIAL DEPOSIT; ENERGY RELEASE RATE; RELIABILITY MODELING; THERMO MECHANICAL SIMULATION;

ELECTRONICS PACKAGING;

EID: 33845595109     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645771     Document Type: Conference Paper

References (13)

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