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Journal of Applied Physics

Volumn 92, Issue 1, 2002, Pages 64-69

Tin whiskers studied by focused ion beam imaging and transmission electron microscopy

(6) Sheng, George T T a Hu, C F a Choi, W J b Tu, K N b Bong, Y Y c Nguyen, Luu c

a MACRONIX INTERNATIONAL CO LTD (Taiwan)

b UNIVERSITY OF CALIFORNIA (United States)

c NATIONAL SEMICONDUCTOR CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSS-SECTIONAL SAMPLE; DRIVING FORCES; ELECTRONIC PACKAGING; FOCUSED ION BEAM IMAGING; GRAIN BOUNDARY PRECIPITATE; GROWTH DIRECTIONS; LEAD FRAME; PB FREE SOLDERS; PURE SN; ROOM TEMPERATURE; SN WHISKER; SPONTANEOUS GROWTH; TIN WHISKER;

CRYSTAL WHISKERS; ELECTRONICS PACKAGING; EUTECTICS; FOCUSED ION BEAMS; GRAIN BOUNDARIES; LEAD; SURFACE MOUNT TECHNOLOGY; TRANSMISSION ELECTRON MICROSCOPY;

TIN;

EID: 0036640490 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.1481202 Document Type: Article

Times cited : (145)

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