Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 36 A, Issue 1, 2005, Pages 55-64

  Deng, X ^a   Sidhu, R S ^a   Johnson, P ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BRITTLE FRACTURE; COMPUTER SIMULATION; COPPER; FINITE ELEMENT METHOD; INTERMETALLICS; MORPHOLOGY; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN HARDENING; YIELD STRESS;

INTERMETALLIC THICKNESS; SOLDER REFLOW; THERMAL AGING;

TIN ALLOYS;

EID: 13944265579     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-005-0138-8     Document Type: Article

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