Influence of intermetallic properties on reliability of lead-free flip-chip solder joints

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 51-57

  Limaye, Paresh ^a,b   Vandevelde, Bart ^b   Labie, Riet ^b   Vandepitte, Dirk ^a   Verlinden, Bert ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b IMEC   (Belgium)

Author keywords

Finite element thermomechanical analysis; Intermetallics modeling; Lead free solders; Solder fatigue; Under bump metallization (UBM)

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERMETALLICS; RELIABILITY; STRAIN; THERMAL CYCLING;

LEAD-FREE SOLDERS; UNDER BUMP METALLIZATION;

SOLDERED JOINTS;

EID: 40549108338     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.909459     Document Type: Article

References (12)

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