Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints

Materials Science and Engineering: A

Volumn 444, Issue 1-2, 2007, Pages 75-83

  Lee, Yang Hsien ^a   Lee, Hwa Teng ^b  

^a SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compound (IMC); Microstructure; Shear strength; Single shear lap joint

Indexed keywords

FRACTURE; INTERMETALLICS; MICROSTRUCTURE; SHEAR STRENGTH; TIN ALLOYS;

INTERFACIAL MICROSTRUCTURE; SINGLE SHEAR LAP JOINT; SOLDER MATRIX;

SOLDERED JOINTS;

FRACTURE; INTERMETALLICS; MICROSTRUCTURE; SHEAR STRENGTH; SOLDERED JOINTS; TIN ALLOYS;

EID: 33845263626     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.08.065     Document Type: Article

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