Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 1050-1058

  Rist, Martin A ^a   Plumbridge, W J ^a   Cooper, S ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

Constitutive equations; Creep; Pb free solder

Indexed keywords

CONSTITUTIVE EQUATIONS; PB FREE SOLDER;

CREEP; LIFE CYCLE; STRUCTURAL ANALYSIS; TENSILE STRESS; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 33745105700     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692566     Document Type: Conference Paper

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