Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2329-2334

  Yoon, Jeong Won ^a   Moon, Won Chul ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Coupling effect; Electroless nickel immersion gold (ENIG); Interfacial reaction; Pb free solder; Sn Ag Cu solder

Indexed keywords

AGING OF MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; REACTION KINETICS; TIN COMPOUNDS;

COUPLING EFFECT; ELECTROLESS NICKEL-IMMERSION GOLD (ENIG); INTERFACIAL REACTION; PB-FREE SOLDER; SN-AG-CU SOLDER;

SOLDERED JOINTS;

EID: 33751216492     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.027     Document Type: Article

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